Operating staff should conform to rigorous operations in the whole process so that components are stopped from being affected. As a result, board reliability can be greatly ensured.Īs a type of moisture sensitive component, BGAs have to be stored in constant temperature and dry environment. In PCBCart, ultrasonic cleaner is used on assembled PCBs to guarantee them to be totally clean. Therefore, it’s so important to thoroughly clean PCBs prior to assembly. Also, PCB surface may be covered by dust in the process of PCB moving and storage. Baking can be carried out under the temperature of 110☑0℃ for two hours. Baking can be implemented on PCBs to stop moisture from leading to soldering defects.

Third, PCBs should be baked and/or cleaned. Once the humidity inside the bag exceeds or equals indicator value and the corresponding circle will become pink. The color on card can be seen to tell about the humidity within the bag and the effect of desiccant. The indicator card is capable of conveniently and economically inspecting whether humidity is in the control range. PCBs should be packed in vacuum and container should include moisture barrier bag and moisture sensitive indicator card. Second, PCBs should be properly stored and applied. Some products call for ROHS requirement and lead-free surface finish, lead-free HASL, lead-free ENIG or lead-free OSP can be applied. There are a couple of surface finishes available and surface finish introductions and comparison should be clear in your mind. Thus, the discussion will be displayed from two aspects: before soldering and during soldering.įirst, proper surface finish should be picked up to be compatible with project or product requirement. To optimize BGA soldering in SMT process, essential measures should be made before and during soldering process. SPI (Solder Paste Inspection) (Optional).SMT assembly mainly consists of the following steps: Up to now, we’ve served more than 10,000 customers from over 80 countries and regions around the world with HIGH-RELIABILITY and LOW-COST bare PCBs and assembled PCBs that have been widely applied in numerous fields covering medical care, industrial control, transportation, military, aerospace, IoT etc. PCBCart has been serving globe electronics for 14 years. It’s necessary to indicate that all the tips are summarized based on manufacturing experience in PCBCart’s workshop. So, this article will discuss the key elements to be captured in the process of SMT assembly. Therefore, it is first and foremost to guarantee the quality of BGA solder balls by effectively stopping solder defects from being generated. However, rework always costs a lot, which is absolutely NOT called for by OEMs. Once defects are found out, rework has to be implemented. Up to now, Automated X-ray Inspection is applied to help exposing the defects of BGA solder balls including void, displacement, bridging, cold solder etc. Because BGA (Ball Grid Array) solder balls are hidden under the body, it’s quite difficult to inspect their performance.

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